Manho Lee,Jun So Pak,Joungho Kim's Electrical Design of Through Silicon Via PDF

By Manho Lee,Jun So Pak,Joungho Kim

Through Silicon through (TSV) is a key expertise for understanding third-dimensional built-in circuits (3D ICs) for destiny high-performance and low-power platforms with small shape elements. This ebook covers either qualitative and quantitative techniques to provide insights of modeling TSV in a diverse viewpoints comparable to sign integrity, strength integrity and thermal integrity. lots of the research during this e-book contains simulations, numerical modelings and measurements for verification. the writer and co-authors in every one bankruptcy have studied deep into TSV for a few years and the amassed technical know-hows and advice for comparable topics are comprehensively covered.

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Electrical Design of Through Silicon Via by Manho Lee,Jun So Pak,Joungho Kim


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