By Sheng Liu,Yong Liu
- Models and simulates a number of procedures in production, reliability and trying out for the 1st time
- Provides the abilities helpful for digital prototyping and digital reliability qualification and testing
- Demonstrates concurrent engineering and co-design methods for complicated engineering layout of microelectronic products
- Covers packaging and meeting for average ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects
- Appendix and colour pictures on hand for obtain from the book's significant other website
Liu and Liu have optimized the e-book for working towards engineers, researchers, and post-graduates in microelectronic packaging and interconnection layout, meeting production, digital reliability/quality, and semiconductor fabrics. Product managers, software engineers, revenues and advertising employees, who have to clarify to shoppers how the meeting production, reliability and trying out will influence their items, also will locate this booklet a serious resource.
Appendix and colour model of chosen figures are available at www.wiley.com/go/liu/packaging
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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing by Sheng Liu,Yong Liu
by James
4.3
